YES (Yield Engineering Systems), a prominent provider of innovative technologies for materials and interface engineering, has announced that it has received multiple orders for its state-of-the-art VertaCure PLP systems from a leading semiconductor manufacturer based in Japan. These systems are set to play a crucial role in the manufacturing processes for artificial intelligence (AI) and high-performance computing (HPC) solutions, where they will facilitate advanced 2.5D and 3D packaging. This development underscores YES’s reputation for delivering cutting-edge tools that combine superior quality with scalability, meeting the demands of both research and development (R&D) environments and high-volume manufacturing (HVM) flows.
VertaCure PLP: Revolutionizing Advanced Packaging with Superior Performance
The VertaCure PLP system is a fully automated vacuum curing solution designed to ensure the complete removal of residual solvents, precise management of heating and cooling rates, and uniform temperature distribution across substrates. One of its key advantages is its ability to eliminate outgassing after the curing process, a critical factor for maintaining cleanliness and preventing contamination in advanced packaging applications. Furthermore, the system boasts exceptional particle performance, meeting the stringent requirements of semiconductor manufacturing.
This innovative tool is highly versatile and supports multiple panel sizes, including 600 mm x 600 mm, 510 mm x 515 mm, and 300 mm x 300 mm. This flexibility makes it an ideal solution for addressing the growing demand for larger substrates in AI and HPC applications, as the semiconductor industry shifts toward panel-based substrates to meet increased performance, memory, and heat dissipation needs.
Industry Insights and Key Benefits of VertaCure PLP
Saket Chadda, Senior Vice President of the Dry Business Unit at YES, highlighted the critical role of VertaCure PLP in addressing the challenges posed by the evolving requirements of AI and HPC solutions:
“Today’s AI and HPC solutions are moving to a chiplet-based architecture that provides better performance, larger memory, and allows more heat dissipation. These solutions also require larger substrates. To accommodate these large substrate sizes and increasing bandwidth requirements, the semiconductor industry is transitioning to panel-based substrates. VertaCure PLP is a production-proven automated vacuum cure system that delivers superior film performance and significantly higher throughput compared to atmospheric curing systems.
“It features a multi-zone temperature control system with laminar flow for excellent uniformity and particle performance. This capability is essential for curing Polyimide, PBO, and build-up layers, as well as for bonding anneal applications. Additionally, the system enhances mechanical, thermal, and electrical properties across a wide range of polymers, which are critical for wafer-level packaging in AI and HPC applications.”
Reinforcing Market Leadership
Alex Chow, Senior Vice President of Worldwide Sales and Business Development at YES, emphasized the significance of this latest order:
“This substantial purchase order firmly establishes YES as the market leader for curing tools in advanced semiconductor manufacturing. Our VertaCure PLP product line is renowned for offering a controlled, reproducible, and scalable manufacturing process for bonding and polymer cure applications. The system delivers superior quality and an excellent total cost of ownership, particularly for the production of advanced 2.5D and 3D packaging solutions for the semiconductor industry.”
Chow further highlighted how YES’s VertaCure PLP systems meet the growing demand for reliable and efficient solutions in advanced packaging markets, providing semiconductor manufacturers with the tools needed to achieve high throughput, precision, and scalability.
About YES: Driving Innovation in Advanced Packaging Solutions
YES, headquartered in Fremont, California, is a leading global provider of differentiated technologies for materials and interface engineering. The company serves a diverse range of markets, including advanced packaging for AI and HPC, memory systems, and life sciences.
YES specializes in designing and manufacturing cutting-edge, cost-effective production equipment tailored to semiconductor advanced packaging solutions for wafers and glass panels. Its product portfolio includes vacuum cure, coating, and annealing tools; fluxless reflow systems; thru-glass via and cavity etch tools; and electroless deposition equipment. These technologies enable YES’s customers to develop next-generation solutions that address the growing complexities of modern semiconductor manufacturing.
With a growing global footprint and a commitment to innovation, YES continues to set benchmarks in the semiconductor industry. The company’s focus on providing reliable and scalable solutions has made it a trusted partner for leading manufacturers worldwide.
