Entegris (Nasdaq: ENTG) and the U.S. Department of Commerce have agreed to a preliminary Memorandum of Terms (PMT) for potential funding of up to $75 million under the CHIPS and Science Act. This funding aims to support Entegris in establishing a cutting-edge facility in Colorado Springs. The facility will focus on enhancing semiconductor manufacturing capabilities in the U.S., particularly through the production of Front-Opening-Unified Pods (FOUPs) and advanced filtration products critical to semiconductor processes.
Bertrand Loy, Entegris’ president and CEO, emphasized the significance of this federal support in strengthening domestic semiconductor infrastructure. The expansion is set to create about 600 new jobs in Colorado Springs over the next few years, spanning various roles from manufacturing to leadership positions. Additionally, the project anticipates generating approximately 500 construction jobs by 2030.
Entegris’ commitment to innovation and sustainability is integral to the project, aligning with their Corporate Social Responsibility goals. The facility, slated to commence operations in 2025, will operate in phases to initially produce FOUPs and liquid filter membranes, expanding later to include advanced filtration and fluid handling solutions. Environmental sustainability features prominently, with targets set to reduce greenhouse gas emissions and enhance water recovery and recycling measures.
The initiative also underscores collaboration with Microchip Technology Inc., educational institutions, and local workforce development programs to foster a robust technology ecosystem in Colorado Springs. Government officials have praised the project for its contribution to national security and economic growth, highlighting its role in revitalizing U.S. semiconductor manufacturing capabilities.
Overall, the investment signifies a pivotal moment in advancing semiconductor technologies domestically, bolstering Colorado’s standing as a technology hub, and creating substantial economic benefits for the region.