DuPont has announced its participation in the upcoming Taiwan Printed Circuit Association (TPCA) Show, which will take place at the Taipei Nangang Exhibition Center from October 23-25, 2024. Located at Booth #K409, DuPont will present a broad portfolio of advanced circuit materials and solutions, focusing on fine line technology, advanced packaging, signal integrity, and thermal management.
As part of the event, DuPont will also collaborate with industry leaders in a session titled “Shaping Our Future with AI by Next-Gen Substrate and Packaging” at the IMPACT Conference. This session will explore advancements in packaging and integrated circuit materials tailored for artificial intelligence applications, covering topics such as the characteristics of organic substrates, the evolution of packaging materials, and the challenges facing AI-driven integrated circuit substrates. Experts from Taiwan Semiconductor Manufacturing Company, Samsung Electronics, Leading Interconnect Semiconductor Technology, and DuPont’s Interconnect Solutions team will share their insights.
“Our latest technological innovations underscore DuPont’s commitment to driving AI-forward through collaboration and industry-leading solutions. As a leader in advanced interconnect and thermal management technologies, we are dedicated to boosting data processing speeds and ensuring reliable data transfer, which are essential for AI functionality. Our session at the IMPACT Conference will highlight innovations in advanced packaging, such as bump plating for HBM and 2.5D/3D packaging and seed layer techniques for glass substrates, pushing AI technology boundaries,” said Yuan Yuan Zhou, Global Business Director for Advanced Circuit & Packaging at DuPont.
DuPont will showcase cutting-edge bump plating technologies, including the DuPont™ Solderon™ BP TS7100SA solder, designed to meet the growing demand for micro-bumps in high-bandwidth memory (HBM) and advanced packaging. The technology delivers increased input/output density and ensures reliable performance in fine-pitch applications through precise control over silver composition and void-free soldering.
Additionally, DuPont will introduce a new seed layer method for glass substrates, addressing challenges with via coverage and adhesion found in conventional techniques. This innovative polymer-based adhesion promoter and electroless copper process enable complete via coverage and robust copper adhesion under low-temperature conditions, making it well-suited for advanced electronics.
At the TPCA Show, DuPont’s offerings will revolve around three key themes: fine line technology, advanced packaging, and signal integrity & thermal management. Fine line technology facilitates the integration of complex circuits within compact spaces for improved efficiency. Advanced packaging optimizes space utilization and supports high-density connections, crucial for AI’s rapid data processing needs. Effective signal integrity and thermal management are vital for reliable performance in high-powered computing environments.
DuPont experts will be available at the booth to discuss these advancements and industry trends, offering attendees a chance to explore solutions tailored for AI applications.
