DuPont Unveils Innovative Advanced Circuit Materials at Shanghai Exhibition

DuPont to Showcase Cutting-Edge Circuit Materials at International Electronic Circuits Exhibition 2025

DuPont is set to highlight its innovative solutions at the 2025 International Electronic Circuits Exhibition (Shanghai), scheduled to take place from March 24-26 at the National Exhibition and Convention Center (NECC). The company will be exhibiting in Booth #8A31, showcasing its diverse portfolio of advanced circuit materials and solutions designed to push the boundaries of fine-line technology, signal integrity, and thermal management. With a focus on high-performance electronics, DuPont aims to address the increasing demand for cutting-edge materials in the rapidly advancing world of electronics.

Meeting the Demands of Emerging Technologies

“As artificial intelligence (AI), machine learning, and 5G technologies continue to evolve, the demand for high-performance devices is driving innovations in packaging substrates and high-end printed circuit boards (PCBs),” said Yuan Yuan Zhou, Global Business Director of Advanced Circuit & Packaging at DuPont. “With our state-of-the-art materials and integrated solutions, we are helping PCB manufacturers meet the increasing needs for miniaturization, integration, and performance. Our work in interconnect materials plays a crucial role in supporting AI infrastructure, optimizing speed, efficiency, and reliability.”

DuPont’s innovations are driven by its decades of expertise in material science, addressing the rapidly expanding integrated circuit (IC) substrate and high-end PCB markets. These markets are fueled by the rising demand for AI servers, data centers, networking technologies, autonomous vehicles, and 5G applications. DuPont’s offerings provide solutions that tackle the challenges of performance, miniaturization, reliability, and cost efficiency—all critical factors in the next-generation electronics sector.

Comprehensive Solutions for the PCB Market

At the exhibition, DuPont will present a wide range of advanced solutions aimed at enhancing the capabilities of PCBs. The company’s product portfolio includes innovative materials that address the most pressing challenges of today’s high-performance electronics. Some key products to be featured include:

  1. DuPont™ Circuposit™ SAP8000 Electroless Copper DuPont’s innovative SAP metallization technology, Circuposit™ SAP8000, is specifically designed for AI server CPU and GPU chip applications. This ionic-based catalyst electroless copper process optimizes advanced packaging, meeting the demands for low-roughness dielectrics. It offers essential properties like low dielectric constant (Dk) and low dissipation factor (Df), crucial for fine-line and high-frequency designs. SAP8000 provides improved performance and reliability for AI-driven devices, addressing the needs of next-generation electronics.
  2. DuPont™ Microfill™ SFP-II-M Acid Plating Copper DuPont’s Microfill™ SFP-II-M is a novel acid plating copper solution, engineered to optimize pattern distribution for large AI chips. Ideal for high-performance computing applications, this solution ensures consistent pattern distribution across large unit sizes, making it highly effective for large-scale AI chip integration. Microfill™ SFP-II-M is a key material for optimizing the design and performance of advanced computing devices.
  3. DuPont™ Riston® DI1600 & DI1600M Dry Film Photoresist The Riston® DI1600 & DI1600M are advanced dry film photoresist solutions designed for fine-line direct imaging in IC substrate applications. These products deliver exceptional adhesion, resolution, and high-yield performance, making them ideal for applications where precision and reliability are critical. These photoresists are integral to supporting the demanding requirements of fine-line and high-performance IC substrates used in AI, 5G, and other high-tech industries.
  4. DuPont™ Riston® DWB8100M Dry Film Photoresist DuPont’s Riston® DWB8100M is a high-performance direct imaging solution tailored for fine copper pillar and thick copper mSAP applications. This solution is optimized for achieving excellent fine-line and via resolution, offering strong bottom adhesion to minimize underplating risks. Riston® DWB8100M ensures stable yield performance, providing a straight dry film and copper trace profile with low trace voids. It is particularly suitable for advanced IC substrate applications, where precision is essential.

DuPont Unveils Innovative Advanced Circuit Materials at Shanghai Exhibition

Driving Innovation in AI and High-End Electronics

DuPont’s leadership in advanced circuit materials positions it at the forefront of the rapidly evolving electronics industry. As AI, machine learning, and 5G technologies continue to drive demand for smaller, faster, and more reliable electronic devices, DuPont’s innovative materials play a pivotal role in enabling manufacturers to meet these needs. The company’s solutions are designed to enhance the performance of high-end PCBs, providing the necessary foundation for the next generation of AI-driven electronics.

Expert Insights and Networking Opportunities

At the 2025 International Electronic Circuits Exhibition, DuPont’s team of experts will be available at the company’s booth to discuss the latest technological advancements, share industry insights, and provide detailed information about the company’s product offerings. Attendees will have the opportunity to explore DuPont’s comprehensive solutions for the PCB market and learn how these materials can be leveraged to address the growing demands of miniaturization, integration, and high performance in the electronics industry.

By showcasing its innovative solutions at this prestigious event, DuPont reinforces its commitment to supporting the next generation of electronics. As the demand for cutting-edge materials continues to rise, DuPont remains at the forefront of driving innovation in the PCB and electronics industries, providing critical materials that enable the development of high-performance devices essential for AI, 5G, and other emerging technologies.

About DuPont
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.

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