DuPont Showcases Cutting-Edge Interconnect Technologies to Advance AI and Next-Gen Electronics at JPCA Show 2025
DuPont a global innovation leader in materials and technology, proudly announces its participation in the upcoming Total Solution Exhibition for Electronic Equipment 2025, better known as JPCA Show 2025. The event takes place from June 4 to June 6 at Tokyo Big Sight East Exhibition Halls, where DuPont will be featured. Here, the company will highlight its extensive portfolio of advanced interconnect solutions—technologies that are driving the evolution of next-generation electronics and artificial intelligence (AI) infrastructure.
At the show, DuPont aims to demonstrate its industry leadership in materials science through a comprehensive range of interconnect products that address critical performance requirements in fine-line circuitry, signal integrity, power delivery, and thermal management—all vital elements in modern electronics.
Commitment to Innovation and Longstanding Industry Leadership
Yuan Yuan Zhou, Global Business Director, Advanced Circuit & Packaging, Interconnect Solutions, emphasized the significance of DuPont’s presence at JPCA 2025:
“Our participation at JPCA 2025 underscores our commitment to innovation within the electronics industry. For over five decades, we have worked alongside our partners to deliver groundbreaking advancements across the electronics value chain. Our strategic focus on integrated circuit (IC) substrates, advanced printed circuit boards (PCBs), and advanced packaging is helping to shape the future of computing and connectivity.”
DuPont’s expertise in engineering high-performance materials is not only backed by extensive technical capabilities but also by a deep understanding of customer needs, enabling the company to co-develop solutions that meet demanding design and manufacturing specifications.
AI Driving Surge in IC Substrate Demand
The rapid growth of artificial intelligence applications—from generative models to data-intensive computing—has accelerated the global need for high-performance IC substrates. Japan, a leader in advanced electronics manufacturing, plays a pivotal role in supplying innovative materials and processes that enable this AI transformation.
IC substrates serve as critical connectors between silicon-based AI chips and printed circuit boards, facilitating high-speed data transfer and efficient thermal dissipation. As AI chips grow in complexity and power consumption, advanced interconnects are required to maintain system integrity, improve signal quality, and manage heat effectively.
With the IC substrate market expected to see significant growth over the coming years, DuPont’s broad materials portfolio is well-positioned to help customers optimize manufacturing efficiency and achieve faster time-to-market.
DuPont’s End-to-End Interconnect Portfolio
At JPCA 2025, DuPont is unveiling a wide selection of its latest interconnect innovations designed to meet the needs of IC substrate and PCB manufacturers. These include:
1. DuPont™ Circuposit™ Desmear and Electroless Copper
Essential for mSAP (modified semi-additive process) and SAP (semi-additive process), this solution supports advanced metallization steps with uniform coverage and excellent adhesion, critical for forming the fine lines required in high-density interconnects.
2. DuPont™ Copper Gleam™ Electrolytic Copper
This product enhances core layer plating through conformal through-hole plating. It enables excellent via filling and uniform copper distribution, improving both structural reliability and electrical performance in multilayer PCBs.
3. DuPont™ Microfill™ Acid Copper Series
- Microfill™ SFP-II-M delivers superb pattern uniformity for high-performance computing and AI chip substrates.
- Microfill™ GFH-100 fills high-aspect-ratio through-glass vias (TGVs) using a unique waveform and one-bath plating, streamlining the production process.
- Microfill™ AHF supports the creation of stacked via structures, accommodating the complexity of high-density packages with minimal defects.
4. DuPont™ Riston® Dry Film Photoresist
Available in variants such as Riston® DI1600 and DI1600M, these photoresists support fine-line imaging using direct imaging (DI) technology. With superior adhesion and resolution, they ensure reliable yields in IC substrate fabrication, particularly in core and build-up layers, as well as for final finishes and copper pillar formation.
5. DuPont™ Solderon™ TS7000 Series Solder
This SnAg micro-bump plating solution is designed for high-bandwidth memory (HBM) and other AI-intensive chip applications. It ensures excellent coplanarity for fine-pitch and mixed-pitch micro-bumps and offers the flexibility of both soluble and insoluble electrode plating methods.
6. DuPont™ CYCLOTENE™ Dry-Film Photo-Imageable Dielectric (DF-PID)
An advanced dielectric material for fan-out panel level packaging (FOPLP) and glass core substrates. Unlike liquid dielectrics, CYCLOTENE™ DF-PID can achieve the required film thickness in a single lamination step, improving manufacturing throughput and reducing defects such as voids and delamination. The material has passed rigorous reliability tests, including multi-reflow, biased highly accelerated stress test (bHAST), and high-temperature storage (HTS).
7. DuPont™ Pyralux® ML Laminates
Representing a breakthrough in non-copper-based flexible materials, Pyralux® ML laminates are engineered for next-generation electronics, delivering superior thermal and mechanical performance. These materials offer OEMs a customizable solution suited for high-speed, high-frequency applications.
8. DuPont™ Pyralux® AP Flexible Copper-Clad Laminate
This double-sided polyimide-based laminate ensures exceptional signal transmission at high frequencies. Thanks to its unique dielectric properties and manufacturing process, Pyralux® AP is ideal for applications requiring low transmission loss, such as advanced communication infrastructure and AI systems.
Integrated Expertise and Customer Collaboration
DuPont’s value proposition lies not just in its materials, but in its collaborative approach. Customers who visit the DuPont booth at JPCA 2025 will have the opportunity to engage directly with technical experts, discuss their design and production challenges, and explore customized solutions that combine materials innovation with process expertise.
By integrating its capabilities across multiple layers of electronic design—IC substrates, PCBs, packaging, and assembly—DuPont offers a holistic portfolio that accelerates product development, improves yields, and enhances device performance.
Shaping the Future of Electronics
As industries transition to AI-driven computing, autonomous systems, and ultra-fast connectivity, the demand for more compact, efficient, and high-speed electronic architectures will continue to grow. DuPont’s solutions help manufacturers meet these challenges by delivering:
- Lower dielectric constants (Dk) and dissipation factors (Df) for better signal integrity.
- Higher thermal conductivity to manage increased power densities.
- Fine-line resolution to support miniaturization and increased circuit complexity.
- Reliability and manufacturability, even in the most demanding environments.
