AGY and JPS Composite Materials Partner to Produce North America’s First Low CTE Glass Fiber Fabric
AGY, a leading manufacturer of advanced specialty glass fibers, has announced a strategic partnership with JPS Composite Materials LLC to produce North America’s first low coefficient of thermal expansion (Low CTE) glass fiber fabric tailored for advanced integrated circuit (IC) substrates and next-generation semiconductor packaging technologies. This collaboration represents a significant step toward establishing a fully domestic supply chain for high-performance reinforcement materials used in critical semiconductor applications.
The partnership combines AGY’s proprietary L-HDI™ ultra-low CTE glass fiber, manufactured at its Aiken, South Carolina facility, with JPS Composite Materials’ precision weaving and fabric production capabilities at its Statesville, North Carolina facility. By merging these complementary strengths, the companies aim to provide a North American source of advanced glass fiber fabric, reducing reliance on international supply chains and supporting the growing demand for semiconductor-grade materials.
Low CTE glass fiber fabric is essential for enhancing IC substrate performance. It improves dimensional stability, minimizes warpage, and allows for higher interconnect density, all of which are critical for advanced packaging platforms such as Chip-on-Wafer-on-Substrate (CoWoS) and System-on-Integrated-Chips (SoIC). These platforms are widely adopted in AI, data center, and high-performance computing applications, where higher bandwidth, better power efficiency, and increased functional integration are key performance metrics.
Patrick Hunter, Chief Commercial Officer and President of AGY, emphasized the strategic significance of the partnership, stating that establishing a North American source for low CTE glass fiber fabric is a major milestone for the semiconductor supply chain. He highlighted that AGY’s L-HDI glass fiber platform is specifically designed to meet the increasing dimensional stability and dielectric performance requirements of next-generation IC substrates. The collaboration with JPS Composite Materials enables the delivery of a fully domestic solution, enhancing supply chain resilience while supporting leading-edge packaging innovation.
AGY’s L-HDI glass fiber offers ultra-low CTE, excellent dielectric properties, and consistent filament geometry, all of which are critical for producing high-quality electronic laminates and IC substrates. JPS Composite Materials LLC contributes decades of experience in precision weaving and fabric manufacturing, ensuring tight construction control and quality standards necessary for semiconductor-grade materials. This combination of advanced fiber technology and skilled fabric production ensures that the resulting material meets the stringent demands of high-performance electronic applications.
Keith Bendyk, President of JPS Composite Materials, highlighted that the partnership positions both companies at the forefront of advanced electronics materials manufacturing in the United States. He noted that by leveraging AGY’s specialty fiber technology and JPS’s manufacturing expertise, the companies can now produce a material that is essential for AI infrastructure and next-generation semiconductor packaging. This development is particularly significant given the growing emphasis on domestic production of critical semiconductor materials, which supports U.S. initiatives to enhance supply chain security and localize manufacturing for high-tech industries.
The collaboration between AGY and JPS not only addresses immediate production needs but also aligns with broader efforts to advance domestic capabilities in semiconductor materials. By producing low CTE glass fiber fabric domestically, the partnership strengthens the U.S. position in supplying materials for AI, aerospace, defense, and high-performance computing markets. This initiative ensures that critical technologies have a reliable, local source for materials required in cutting-edge applications.
Low CTE glass fiber fabrics are engineered to provide dimensional stability under thermal cycling, which is crucial in IC substrates where heat-induced expansion can cause warpage, misalignment, and performance degradation. By maintaining tight control over the coefficient of thermal expansion, these fabrics enable higher reliability and longer lifespan of semiconductor devices. In addition, the combination of ultra-low CTE and excellent dielectric properties supports advanced packaging technologies that demand precise electrical performance.
Initial production of the low CTE glass fiber fabric is already underway, with customer qualifications currently in progress. This step marks a significant advancement in domestic manufacturing capabilities for materials critical to the semiconductor supply chain. AGY and JPS are committed to delivering consistent quality and performance to meet the demanding requirements of advanced electronic applications.
By establishing a fully domestic supply chain, AGY and JPS also help mitigate risks associated with international logistics, geopolitical uncertainties, and potential disruptions in global material sourcing. This strategic approach not only ensures reliability for semiconductor manufacturers but also strengthens the overall competitiveness of the North American semiconductor industry.
The AGY and JPS partnership demonstrates the importance of collaboration between fiber producers and fabric manufacturers in driving innovation. By combining AGY’s L-HDI glass fiber technology with JPS’s expertise in precision weaving and fabric production, the companies are creating a material that is not only technically advanced but also strategically significant for the U.S. semiconductor ecosystem.
In addition to supporting high-performance computing and AI applications, the low CTE glass fiber fabric has potential applications in aerospace and defense industries, where dimensional stability and material reliability are paramount. The ability to produce these fabrics domestically further ensures that critical sectors have access to high-quality materials without dependency on foreign sources.
This partnership underscores the growing importance of domestic semiconductor material production as the industry continues to expand and innovate. By providing a North American source for advanced low CTE glass fiber fabric, AGY and JPS are addressing both technological and strategic needs, offering a solution that enhances performance, reliability, and supply chain security for next-generation electronic devices.
The AGY-JPS collaboration sets a new benchmark for domestic production of advanced electronic materials, combining cutting-edge fiber technology with precision fabric manufacturing to support the evolving demands of semiconductor packaging and high-performance applications. As production scales and customer qualifications advance, the partnership is poised to make a significant impact on the North American semiconductor supply chain and the broader electronics industry.
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